Adhesive/Sealant

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 6.9MN/m2. It is 100% reactive and fully meets USP Class VI requirements for medical applications. This silver-filled epoxy adhesive/sealant has an electrical conductivity with a volume resistivity < 0.001 Ωcm. Serviceable over -15 to 204°C, it is resistant to severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents. The thixotropic paste and has a specific gravity of 2.90 at 25°C. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 149°C or 40 to 90 minutes at 121°C. With minimal shrinkage during cure and a Shore D hardness of 60 to 80, the adhesive bonds well to a variety of substrates including metals, glass, vulcanized rubbers, ceramics, and many plastics.