Recently developed by Master Bond the EP30HTLV low viscosity, two component epoxy adhesive/sealant, coating and casting compound is formulated to cure at room temperature or more rapidly at elevated temperatures. It features high dimensional stability, an optical clarity and temperature resistance up to 204°C, while conforming to Title 21, U.S. Code of Federal Regulation, FDA Chapter 1, Section 175.105 and 175.300 for food applications. The epoxy has a 4 to 1 mix ratio by weight. It is 100% reactive and does not contain any solvents or volatiles. Its low viscosity and shrinkage of -0.0003 inches/in make it well suited for casting. Adhesion to metals, glass, ceramics, woods, vulcanized rubbers and many plastics is high. The hardened compound has superior electrical insulation properties. It resists exposure to water, oil and most organic solvents. The epoxy’s refractive index is 1.54 and the spectral transmittance (3100-9000Å) is 97%. Its dielectric strength is 17.3 kV/mm and volume resistivity is >1015 Ωcm. Color of Part A is clear and Part B is clear.
Edited by: Teoman Tugsuz
