BCM SENSOR has presented a newly developed flip-chip pressure sensor die for mass production. This flip-chip sensor die, model SE105, is based on piezoresistive working principle and is manufactured by 6" silicon micro-machining process.
Shown below are two cross section of the SE105 flip-chip sensor die, which can be used for gauge or absolute pressure measurement.
Thanks to the unique manufacturing process, the flip-chip is realized at the SE105 pressure sensor die, resulting in the following advantages comparing to the conventional-structure of pressure sensor dies:
- Either corrosive or conductive pressure medium can have direct contact with sensor dies;
- Die bonding and wire bonding are simplified to one bonding process of flip-chip;
- Improved resistance to harsh environment.
The SE105 flip-chip pressure sensor die features also an outstanding non-linearity of 0.15%fs and an excellent long-term stability of 0.1%fs/year.
