Delta Electronics announces the launch of the DTDM Series of high-precision modular temperature controllers. Designed to meet the stringent demands particularly in the semiconductor industry, the DTDM Series offers unparalleled precision, rapid data exchange, and a compact, modular design. By enabling precise temperature control in critical manufacturing processes, the DTDM contributes to improved energy efficiency and reduced waste.
The DTDM Series stands out with its innovative architecture. This unique design supports a Measurement Host, up to seven Measurement Expansion Modules, eight I/O Expansion Modules, and a Communication Module, enabling a maximum of 32 PID loops and 128 input/output channels. This modularity allows for highly customized configurations tailored to specific application needs, simplifying system design and reducing overall footprint.
The series utilizes advanced control algorithms, combined with a highly integrated modular hardware design. This results in ±0.1% high-precision temperature measurement and a 10 ms temperature sampling period, ensuring optimal process performance and temperature control accuracy. With EtherCAT communication and support for 10/100 Mbps auto-detection (IEEE 802.3/u), real-time monitoring and seamless integration is ensured, enabling faster control loops and improved process optimization. The DIN rail mounting system and compact design simplify installation and minimize space requirements. The Single DTDM Group architecture allows for flexible configuration and expansion.
Enhanced Control Capabilities
The series offers PID Cascade Control and Multi-Loop Control for faster response times and increased precision. Linearization Table and Feed-Forward Control eliminate non-linear temperature errors and compensate for known process disturbances. The Status Database and Logic Operations allow for rapid response and reduced host computer load. The Multi-channel PV Comparison & Alarm feature actively prevents temperature variations between channels, ensuring consistent and reliable temperature uniformity for critical processes. Input Switching and Input Redundancy enable increased system reliability.
The DTDM Series is specifically designed for semiconductor wafer processing equipment, including Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), Oxidation & Diffusion furnaces, silicon etching machines, and Atomic Layer Deposition (ALD). The semiconductor industry is experiencing rapid growth, with increasing demand for advanced manufacturing processes that require precise temperature control. The DTDM Series addresses this need by providing a high-performance, flexible, and reliable solution that meets the industry's evolving requirements.
