High temperatures negatively affect the life of electronic components and assemblies. This is due to the accelerated ageing of many semiconductor materials at high temperatures. Poor electrical connections due to increased contact resistance can cause this, for example. Complex semiconductor components such as processors can also experience elevated temperatures.
Resolution in the micrometer range
The PI 640i infrared camera from Optris is now able to capture infrared images of even complex structures using the new MO2X microscope optics with 2x magnification. For an accurate temperature measurement, 4x4 pixels are required (MFOV). This means that objects as small as 34 µm can now be measured. This means that even the smallest of structures can be analysed at the chip level. The thermal resolution of 80 mK is a very good value for this optic. The focus of the new optic makes it possible to work at a distance of 15 mm from the object to be measured. The optics on the PI Series infrared cameras are easily interchangeable, allowing the system to be used flexibly for different measurement tasks. Together with the supplied high quality microscope stand with fine adjustment, microelectronic assemblies can be easily inspected. The maximum resolution of the infrared camera is 640 x 480 pixels at a frame rate of 32 Hz. Even at 125 Hz, the PI 640i still delivers an impressive 640 x 120 pixels.
The license-free analysis software PIX Connect is included in the scope of delivery; alternatively, a complete SDK is also available.
