Offering a simple 1 to 1 mixing ratio by weight or volume, Master Bond EP21TDCS-LO is an electrically conductive silver-filled epoxy that passes ASTM 595 for NASA low outgassing specifications. It is widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. The adhesive cures at room temperature in 24 to 48 h and in 1 to 2 h at 93ºC, producing tough high strength bonds. It features a tensile shear strength of >12.4 MPa, a T-peel of >875 N/m, and high adhesion to similar and dissimilar substrates. The volume resistivity of the system is <10-3 Ω-cm. Serviceable over 4K to 135ºC temperature range, the adhesive is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil and most organic solvents. With its low drip formula, the adhesive can be conveniently applied with a syringe, knife, spatula or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a 3 month shelf life and glass jars have a 6 month shelf life, if stored at room temperature. The polymer system is available in premixed and frozen syringes, as well as in metal containers.
Edited by: Teoman Tugsuz
